What is the optimal bond line thickness for die attach adhesives?
Although recommendations are application specific, a bond line thickness of 0.5 to 2.0 mil is typically used. However, for relatively small die, a bond line thickness of < 1 mil is typically used. Many process parameters affect bond line thickness. Some relevant parameters include pressure applied, bond height control, and bond time. Spacers are sometimes included in a product formulation to control bond line thickness and minimize die tilt. The bond line thickness is then governed by the size of the spacer in the product. For example a 1 mil diameter spacer controls the bond line thickness to 1 mil.
