Will board laminate material be required to change for Pb-free assembly process?
Pb-free soldering process has a much higher reflow temperature than standard tin-lead process. Laminates such as standard FR4, used mostly in tin-lead assemblies, will not be adequate to support Pb-free processes. Many individuals may suggest moving from a standard FR4 with a Tg (transitition to glass) of 145 degrees C to a laminate rated at 180 Tg. The Tg is no longer meaningful when we consider Lead-Free solder. We now worry about the degrading of the material and how much heat it can withstand over a period of time. This is identified as Td (temperature to decomposition).
Related Questions
- Do I need to make any process or material changes to my PCB assembly process to use Ecliptek RoHS Compliant or RoHS Compliant (Pb-free) products?
- Will board laminate material be required to change for Pb-free assembly process?
- Do all laminate suppliers have material that will meet Pb-free requirements?
