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Why is there a need to qualify Maxim packages and assembly process technologies for 100% Matte Tin Plate?

April 26, 2017assembly matte tin plate Maxim Packages process qualify technologies

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Why is there a need to qualify Maxim packages and assembly process technologies for 100% Matte Tin Plate?

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All package body sizes, assembly materials (mold compound and die attach epoxy), assembly processes (down bond and die coat) and fab processes behave differently in a higher reflow environment (above 240°C). Sufficient reliability data is required from all of these packages and process/fab technologies to assure that product will survive and special packaging requirements are determined to eliminate potential field failures. Note that package and process qualifications can be extended to other packages and process technologies by similarity.