Why is NEXXs Stratus the best Electrodeposition system?
Stratus systems offer several patent-pending advantages. • The Stratus system architecture enables 20 wafers to be plating simultaneously. • The Stratus offers bridge system capability: 200 and 300 mm wafers can be processed at the same time. • Superior process performance yields void-free solder (including lead-free) bumps and TSVs. • A patented, back-to-back wafer holder virtually eliminates repetitive wafer handling and doubles the effective throughput of each process cell. • The Stratus was specifically designed for high throughput/high yield processing; Coupled with lower operating costs, this results in the best cost of ownership for electrodeposition in the packaging industry.
