Important Notice: Our web hosting provider recently started charging us for additional visits, which was unexpected. In response, we're seeking donations. Depending on the situation, we may explore different monetization options for our Community and Expert Contributors. It's crucial to provide more returns for their expertise and offer more Expert Validated Answers or AI Validated Answers. Learn more about our hosting issue here.

Why has Microsemi chosen 100% Matte Tin (Sn) lead finish in spite of concerns regarding whisker growth?

April 26, 2017chosen concerns finish lead matte tin microsemi SN spite

0

Posted

Why has Microsemi chosen 100% Matte Tin (Sn) lead finish in spite of concerns regarding whisker growth?

1 Answer

0

Posted

A. 100% Matte Tin (Sn) plating with a one hour 150C post bake has been chosen due to its good solderability/compatibility with existing PbSn and RoHS / Pb-free board finishes. It is the most common RoHS / Pb-free component finish in the industry. 100% Matte Tin (Sn) plating has been known to be susceptible to tin whisker growth. This phenomenon is typically associated with high stress or bright tin plated finishes. Therefore Microsemi has selected a low stress or matte tin plating chemistry. Several IC manufacturers have shown that the 100% Matte Tin (Sn) finish is much less prone to whisker formation also Microsemi has initiated an extensive tin whisker characterization test on all 100% Matte Tin (Sn) plated packages. Results will be posted on this website as they become available.