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Why does the MC33794 come in both a 54-lead SOICW-EP and a 44-lead heatsink HSOP package?

April 26, 2017heatsink HSOP mc33794 package

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Why does the MC33794 come in both a 54-lead SOICW-EP and a 44-lead heatsink HSOP package?

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The choice of packages is driven by the heat dissipation the subject packages and the users ability to handle fine-pitch packages. The heat generated by the on-board regulators and other internal circuitry limits the maximum power dissipation of the part. Attaching the packages backside exposed pad to copper cladding on the PCB to act as a heat spreader will allow the maximum available current to be drawn.