Why does Amphenol recommend and design press-fit, when other high-density designs use solder terminations? What are the advantages of press-fit?
Amphenol is a leader in backplane systems for avionics/space and defense/aerospace applications. We’re experienced not only in the application of our own connector systems, but also with a wide range of competing interconnect systems, which we’re often called upon to integrate into backplane assemblies for our customers. Many of these are of the press-fit style, although others are through-hole soldered. Amphenol is certified to solder per J-STD-0001, MIL-STD-2000A and several commercial specifications. As an assembler of backplanes, Amphenol understands the difficulties of soldering connectors to thick (> than 0.125″) multilayer backplanes. Amphenol pioneered the press-fit concept to allow a freedom to the designer, and to minimize the cost of ownership through the life of the program. a. Benefits of Press-Fit in Board Construction 1. No need for thermal relief pads. 2. Pad placement only where necessary. 3. Use of heavy copper inner layers. 4. No need for soldermask, except as a scra
