Why are soldered tags so rarely used?
• Soldering is performed at temperature exceeding 250°C and requires substrate film to be able to withstand that temperature. Polyimide laminate with copper conductor and similar substrates are expensive (sometimes over $100 per pound vs $6 per pound for polyester substrate) and are used only for extreme applications requiring such substrate flexibility. • AVANTE solves this problem with a proprietary low cost yet high temperature stable and moisture stable substrate for the RFID applications. This enables the use of soldering interconnections for RFID applications at lower cost than silver thick film process. • A combination of inlay patterns can be used to optimize the copper laminates with minimal waste. • In addition, AVANTE developed the patent-pending “chip-jumper” approach for mass production with this easy to handle form factor for soldering.