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Why are soft-silicone interface materials compressible and at the same time thermally conductive?

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Why are soft-silicone interface materials compressible and at the same time thermally conductive?

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These materials are made of soft-silicone filled with highly thermally conductive ceramic. The consistency and the quantity of the ceramic filling determines the thermal conductivity and the degree of compression. The more ceramic filling there is (with the same type of ceramic or with the same ceramic mix being assumed), the better the thermal conductivity, but the lesser the compression and the harder the material will be.

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