Where is car IC test going?
Yukio Okuda, Sony The purpose of this panel was to explore the future car IC testing that should adapt new business models. However, attendees and panelists focused on today’s issues: how to reach zero defects, which will still be a top priority issue in the future. The panel was moderated by Phil Nigh of IBM, and organized by Yukio Okuda of Sony. The panelists were Hideyuki Aoki (Renesas Technology), Davide Appello (STMicroelectronics), Thomas Burger (Austria Microsystems), Steve Comen (Texas Instruments), and Gary Wittie (Freescale Semiconductor). All the panelist position statements emphasized test cost pressures for safety-critical car ICs. However, the simple way to reach such high quality still wasn’t clear after all the passionate arguments about well-known techniques: high test coverage, scan-based delay test, functional test, suspicious IC rejection, yield improvement by DFM, burn-in, and so on. Another topic that was discussed was KGD (known good die). Today, cars are control
