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Where can I find information (pad layout, assembly, rework, etc.) on the 495 BGA2 (H-PBGA) package?

April 26, 2017assembly layout package pad rework

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Where can I find information (pad layout, assembly, rework, etc.) on the 495 BGA2 (H-PBGA) package?

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This information can be found in Chapter 14 of the Intel Packaging Databook. Moisture sensitivity information can be found in Chapter 8. Consult the Pentium III processor – Low Power datasheet for BGA2 package dimensions.