When I am going to pattern plate my circuit anyway, why do I first have to panel plate the board just after holewall activation?
To insure that all of the through-holes in your finished board are completely covered with a uniform layer of copper, it is essential that the conductive ink layer deposited during activation be as conductive as possible to optimize deposition and adhesion. Exposing the conductive ink to the developing solution can result in a “surface poisoning” of the exposed conductive particles, making it very difficult to plate.
