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What terminal finishes are used in Xilinx Pb-free packages?

April 26, 2017finishes Packages Pb-free terminal Used Xilinx

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What terminal finishes are used in Xilinx Pb-free packages?

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For lead frame packages, the plating material for the leads is 100% Matte Sn. For wire bond BGA packages, the solder balls use a SnAgCu composition. Flip chip packages utilize a SnAgCu composition on the solder balls and a eutectic SnPb composition for the solder bumps. The SnPb composition used on the solder bumps is RoHS compliant based on an exemption.