What solder processes are the IPC land patterns calculated for?
The IPC-7351 Land Patterns have been tested for following solder processes: • Reflow • Infrared • Wave • Vapor Phase • Lead Free There is no difference in the land pattern between any of the above processes except “Lead Free”. For lead free we had to remove 60% of the Paste Mask on all components that have “Thermal Tabs”. This list includes: • QFN • SON • QFP • SOIC • TO (D-PAK) We also found out that by removing 60% of the paste mask it also helps the leaded solder process. In other words, it works for both.