What reliability data is available to prove the capability of C4NP (eutectic PbSn, high-Pb and lead-free)?
Eutectic data is available now. Initial test with lead-free solders have been conducted. However, statistically significant lead free data will be available after the first C4NP bumping line is installed at the Hudson Valley Research Park within IBM Microelectronic Division’s Packaging Operation in July 2005.
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