What qualification tests are performed for lead-free devices?
Since lead-free processing requires higher reflow temperature, LSI has qualified lead-free solutions with optimized material set that will withstand lead-free processing conditions coupled with low K and Pad on I/O technology. Qualification tests include but not limited to: Moisture Resistance Testing (MRT), Temperature Cycling (TC), Temperature/Humidity Bias (THB) and High Temperature Storage (HTS). In addition to the component level testing, LSI also gathers 2nd level data to ensure component quality when mounted onto PCBs. Whisker qualification follows JEDEC JA210, including -55oC to +85oC – TC; room ambient storage, and 55-60oC/85-90%RH storage.