What problems does PrimeYield CMP address?
At 65nm, the surface planarity of a design metal layer is dependent on two factors: the relative metal density for the layer and the cumulative effect of non-planarity in the lower design layers. This is due to the nature of the copper process and the sensitivity of copper to the CMP step. Historically, the CMP problem has been addressed by adding dummy metal to a layer using a rule-based approach. This technique falls short at 65nm, where a model-based analysis approach is required.
