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What Non-Pb finishes have been chosen for Spansion Flash memory products?

April 26, 2017chosen finishes flash memory non-pb products Spansion

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What Non-Pb finishes have been chosen for Spansion Flash memory products?

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Cu (Copper) leadframe packages including: PDIP, PLCC, PQFP, SOIC, SSOP, and TSOP; use 100% matte-Sn (Tin) plating. Laminate packages including both single-die FBGAs and multi-die MCPs use solder spheres composed of SAC 305 (96.5% weight Tin, 3.0% Silver, and 0.5% Copper) in standard packages. SAC 105 (98.5% weight Tin, 1.0% Silver, and 0.5% Copper) or SAC 125 (98.25% weight Tin, 1.2% Silver, 0.5% Copper, and 0.05% Nickel) are used for special applications. Click here for more details.