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What measures have been taken to minimize tin whisker growth?

April 26, 2017growth measures tin whisker

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What measures have been taken to minimize tin whisker growth?

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We use a number of tin whisker mitigation strategies, all following the Jedec JP002 guidelines: www.jedec.org/DOWNLOAD/search/JP002.pdf Through Hole Devices: The pins used in all of our through-hole converters are made of hard silver-copper alloy. The pins are then Nickel underplated to 0.5µm before being pure tin electroplated to 6µm thickness. This thickness of overplating is a compromise between reasonable manufacturing costs and having a thick enough coating to impair tin whisker formation. The surface is not ‘brightened’, also to mitigate tin whisker formation. Finally the pins are annealed according to JIS C3101. This reduces any residual forming stresses, which is one of the other potential causes of tin whisker formation Surface Mount Devices: The carrier frames used in our SMD converters are made from DF42N nickel alloy which is pure tin plated. The pins are hot dipped in Sn-Ag-Cu solder just before injection molding.