What measures are taken by NXP to prevent whisker growth on products?
Along with thorough test procedures, the following measures are introduced into the production process: • use of the appropriate leadframe material • application of the proper chemicals • leadframe pre-treatment prior to plating • tightly controlled, minimum plating thickness • post bake (not discretes) We have investigated whisker behaviour of our products for more than two years and no serious whisker growth has been detected.
