What kind of solder joints can be inspected automatically?
phoenix|x-rays offers evaluation algorithms for all common types of SMT solder joints: BGA, CSP, QFP, Gullwing, J-Lead, QFN, MLF, chip components and, using phoenix|x-ray’s oblique view imaging technique, even thru-hole solder joints such as PTH and THT- Type solder joints. Also the percentage of voiding in solder joints, an particularly crucial factor when examining assemblies, can be determined according to different criteria. For atypical solder joints and new evaluation criteria, the user may create new evaluation routines using the phoenix|x-ray’s Xe² (X-ray image Evaluation Environment).
