What issues impede the adoption of EBG structures in electronic packaging?
The issue has been one of market perception that EBG structures are too large or the frequency of operation is too high. This perception is understandable given that most if not all of the early publications (2003-2005) on power plane noise suppression where not of practical value to the PCB designer. Many EBG related papers were presented by university researchers and showed early results which were not ready for industry adoption. More recent developments of hybrid EBG structures mitigate some of these issues. • Q: Are there any current RF products or applications where EBG structures are being used? A: Not yet. EBG structures for noise suppression at the board and package level are still quite new. Most PCB and package designers are not aware of the possibilities. • Q: What are the software tools that traditionally simulate and analyze the PDN noise challenges which WEMTECs technology addresses? A: Software tools for power integrity analysis include SIwave from Ansoft, Power Si from
