What is the value of a snap-cure system for surface mount technology?
Surface mount adhesives such as APTEK 2310-PMF and APTEK 2311-PMF are based on hybrid resin technologies, which display a snap cure. That is, these adhesives have very long work life at room temperature but when exposed to temperatures 85 ° C and higher, become highly reactive and gel quickly to hold surface-mount components in place, i.e. snap cure. These adhesives are production–friendly and can be used in an inline solder flow operation with cure times under a minute or two at solder reflow temperatures. Please refer to the Technical Data Sheets under the link Technical Info for these snap-cure adhesives. Also refer to the technical paper Development, Evaluation, and Implementation of Thermally Conductive Component Attach Adhesives in Inline Curing SMT Assembly Processes.