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What is the typcial size of a bump after reflow?

bump reflow size typcial
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What is the typcial size of a bump after reflow?

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Assembled joint height depends upon several factors including alloy type, die attach area, land area and the use of solder masking or organic solder preservative. This is because the bump will collapse based upon these factors. A predictable controlled collapse of the bump is recommended.

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