What is the tin whisker issue and does Xilinx test for this?
Tin whiskers are needle-like crystals that may spontaneously grow from a pure tin surface (as used on Pb-free lead frame packages). Xilinx works with industry consortia to understand tin whisker mechanisms and develop solutions to mitigate tin whisker. Various tests have been conducted including temperature cycling, storage, and temperature/humidity. Please contact the Xilinx packaging group for additional information.