What is the specification of lead impurity composition in the lead-free solder?
The specification for lead impurity content in lead-free solder content is under 500ppm. There will always be a small amount of lead contamination from the refining process of tin. This value of o.05% is lower than the 0.1% RoHS limit but care must be taken to avoid lead contamination especially during wave soldering.
Related Questions
- What is the best lead-free solder composition for flip chip interconnects (also in regards to the use of low k dielectrics)? Can this lead-free solder be transfer bumped with C4NP?
- Does dust that settles on lead solder (on hydronic heating pipes) then become contaminated with lead?
- What is the specification of lead impurity composition in the lead-free solder?
