What is the reliability of the package after rework?
• Can this package go through wave solder? a) No. Due to specific design of LLP with contacts on the bottom wave soldering is not possible. • Is National available to assist in manufacturing? a) Yes. Please contact the LLP team in the Package Technology Group through your local National Semiconductor sales engineer. • Are voids acceptable in the solder between the PCB land and the thermal pad of the package after surface mount? a) National has done extensive modeling and studies on the impact of voids and the results are summarized in AN-1187.