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What is the rectangle copper pad on the bottom of TDFN and TQFN packages, and should it be connected to the ground?

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What is the rectangle copper pad on the bottom of TDFN and TQFN packages, and should it be connected to the ground?

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The rectangle copper pad on the bottom of some of the TDFN / TQFN packages is internally connected to the substrate of the die. It can be either floating or connected to the ground of the PCB.

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