What is the recommended de-coupling scheme for LVDS drivers and receivers?
Bypass capacitors must be used on all power pins. High frequency ceramic (surface mount is recommended) 0.1 µF and 0.001 µF capacitors should be used and placed in parallel at the power supply pin with the smallest value capacitor closest to the device supply pin. Additional scattered capacitors over the printed circuit board will improve decoupling. Multiple vias should be used to connect the decoupling capacitors to the power planes. A 10 µF (35 V) or greater solid tantalum capacitor should be connected at the power entry point on the printed circuit board between the supply and ground.