What is the particularity & recommended applications of the adhesive tapes for dicing with ultraviolet sensitive adhesive ?
These tapes are typically used in the operations of wafer or substrate dicing (or in the wafer backgrinding). They are combining 2 properties which are very important for the process and normally opposite. First a high adhesion during dicing so as to avoid the “flying dies” due to the coolant pressure and the movement created by the spindle rotation, secondly after dicing the adhesion should become low so that the dies can be gently picked up without stress. This is particularly important in the case of fragile and thin dies. The UV tape has an acrylic adhesive which is sensitive to UV rays. After exposure to a UV source (typically 254 or 365nm wavelenght ), the adhesive properties change and the force of adhesion become much lower than before UV, typically around 5% of the initial adhesion. The disavantage of the UV tapes is however a higher cost and a shorter lifetime compared to standard non UV films. They must be used when the cost of the individual die or substrate is such that no
