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What is the minimum feature size I can obtain with an LOR bi-layer lift-off process?

April 26, 2017feature lift-off lor minimum obtain process size

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What is the minimum feature size I can obtain with an LOR bi-layer lift-off process?

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LOR A resists are currently used with advanced I-line resists in 0.35um high volume production applications. Superb control of the undercut profile can be obtained with optimized prebake and develop processes. We also offer a line of PMGI resists, which have lower dissolution (undercut) rates than LOR A. These resists are currently used with deep UV resists in 0.25um high volume production applications.