What is the difference between silicon carbide and diamond grinding?
Silicon carbide slurry utilizes a slowly turning cast iron wheel on which drops a “slurry” of grit. Each grit requires a different wheel or at least a lengthy cleaning period between usage of different grits to prevent cross contamination. Diamond grinding uses a horizontal lapping machine at a much higher speed. The “grit” is supplied by diamonds electroplated to the surface of a disk. The disks are then magnetically adhered onto the wheel head. Silicon carbide grinding also is a slow and arduous process. Diamond grinding can move three to four times faster than conventional silicon carbide grinding.
