What is the difference between HTCC and LTCC technology?
• LTCC can be defined as a multilayer circuit fabricated by laminating single green sheets (term for unfired tapes; Green Tape, Dupont) with printed conductor lines etc. on the surface on top of each other and firing them all together in one step. This process is almost similar to that of HTCC, but the big advantage of the LTCC system is the possibility to use low resistivity conductors like silver, gold, copper and alloys with palladium and platinum instead of tungsten and molybdenum; the separation between this two (different) technologies is defined with the firing temperature: in excess of 1000XC for HTCC and below for LTCC (mostly 850 to 875XC, what makes it possible to use silver for conductor lines etc.). The whole process includes several steps that are described under “LTCC Process”. The LTCC technology avoids many disadvantages the others have and offers a couple of benefits: Economizes multiple steps of the manufacture process compared with the conventional thick film techno
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