What is the cause for the thermal contact resistance ?
Thermal contact resistance is caused by air filled voids and micro pores resulting from incomplete contact of the surfaces to each other. Since air has a very low specific thermal conductivity of only 0.0276 W/mK the thermal resistance is very high. The temperature difference therefore is high as well and this has to be added to the temperature difference being caused by the interface material itself. Q: What kind of mechanical fixture is best to be used in be applied when linking interfaces to each other. A: Mounting pressure being evenly applied to the surfaces of semiconductor housing, interface material, heat sink or any cooling plate determines the quality of thermal contact. By using Kunze Folien POWERCLIPS® a perfect adjustment of evenly working pressure is achieved thus leading to an optimisation of the whole system. With the help of graphs showing the relationship of distance vs. mounting pressure of the respective POWERCLIP® a perfect application-design consisting of heat sin
