What is the achievable bumps size and bump pitch?
C4NP has been production qualified to bump wafers with 75 micron bump size and 150 micron pitch. Initial production wafers have also been qualified for 100 micron bump on 200 micron pitch. Also, filling smaller bump molds has been demonstrated down to 25 micron on 50 micron centers, which extends far beyond present ITRS requirements. C4NP can also be used to generate solder balls much larger such as 200-500um diameter.
