What is Samtec’s recommendation for processing the -EM edge mount option on the Q Strip Series?
When processing the Q Series edge mount connectors, the solder paste is placed on the ends of the pads farthest away from the board edge. This is done to minimize the distance the signal leads must travel through the wet paste when the connector is placed on the board. This reduces the “plowing” of the past and the risk of bridging between signal pads. For more information, contact our Interconnect Processing Group.
