What is PVD coating?
Physical Vapor Deposition, or PVD, is a term used to describe a family of coating processes. The most common of these PVD coating processes are evaporation (typically using cathodic arc or electron beam sources), and sputtering (using magnetic enhanced sources or “magnetrons”, cylindrical or hollow cathode sources). All of these processes occur in vacuum at working pressure (typically 10-2 to 10-4 mbar) and generally involve bombardment of the substrate to be coated with energetic positively charged ions during the coating process to promote high density. Additionally, reactive gases such as nitrogen, acetylene or oxygen may be introduced into the vacuum chamber during metal deposition to create various compound coating compositions. The result is a very strong bond between the coating and the tooling substrate and tailored physical, structural and tribological properties of the film. Richter Precision Inc. is constantly working on improvements to PVD processes and coatings. We have de
Physical Vapor Deposition, or PVD, is a term used to describe a family of thin-film coating processes which are applied under vacuum conditions (10-2 to 10-4 Torr). These processes involve the generation of positively charged ions of various metals. These metal ions react with gas ions that are introduced into the chamber in order to create various compositions. The parts to be coated are given a negative bias in order to attract the positively charged ions. The result is a very strong mechanical bond between the coating and the tool. Recently, numerous improvements have been introduced within the PVD coating industry, and Richter Precision Inc. has been leading the way. We have developed new coating compositions, new multi-layer combinations, a family of DLC coating processes, and new technological advancements such as Filtered Arc technology and improved etching processes. We are devoted towards maintaining our position as a leader in PVD coating technology.
