What is Different Types of IC packaging ?
IC are packaged in many types they are: * BGA1 * BGA2 * Ball grid array * CPGA * Ceramic ball grid array * Cerquad * DIP-8 * Die attachment * Dual Flat No Lead * Dual in-line package * Flat pack * Flip chip * Flip-chip pin grid array * HVQFN * LQFP * Land grid array * Leadless chip carrier * Low insertion force * Micro FCBGA * Micro Leadframe Package * MicroLeadFrame * Mini-Cartridge * Multi-Chip Module * OPGA * PQFP * Package on package * Pin grid array * Plastic leaded chip carrier * QFN * QFP * Quadruple in-line package * ROM cartridge * Shrink Small-Outline Package * Single in-line package * Small-Outline Integrated Circuit * Staggered Pin Grid Array * Surface-mount technology * TO220 * TO3 * TO92 * TQFP * TSSOP * Thin small-outline package * Through-hole technology * UICC * Zig-zag in-line package What is Substrate coupling ? In an integrated circuit, a signal can couple from one node to another via the substrate. This phenomenon is referred to as substrate coupling or substrate n
