What is CMP slurry?
CMP slurries are highly engineered chemical formulations, that smooth and flatten the wafer surface. CMP slurries prepare the wafer for subsequent photolithography steps in which the pattern of the integrated circuit is imaged onto the wafer surface. Cabot Microelectronics’ R&D center engages in ongoing development of new CMP slurries to fulfill chipmakers’ next generation process requirements, including development of slurries for copper, aluminum, polysilicon and oxide polishing.
