What is Backward Compatibility?
Backward compatibility is a feature that guarantees functionality with previous standards or versions. Backward compatibility makes it possible for technology to move ahead without making existing technology obsolete. For example, in the fast-paced, highly competitive computer industry, manufacturers and engineers form cooperative groups to develop new standards. Once these standards are adopted, manufacturers create compatible products. This keeps the market competitive and allows consumers a broad choice of products that are guaranteed to be interoperable. If not for backward compatibility, every time a product improved, it would be incompatible with the existing infrastructure. Imagine buying a new spark plug for a three-year old car, only to find out you require a new car to use the plug! Computer systems, software, networks, and digital devices all function with a great deal of interdependence. As each component, device, program, network, or infrastructure is improved, backward co
Backward compatibility is a feature that guarantees functionality with previous standards or versions. Backward compatibility makes it possible for technology to move ahead without making existing technology obsolete. For example, in the fast-paced, highly competitive computer industry, manufacturers and engineers form cooperative groups to develop new standards. Once these standards are adopted, manufacturers create compatible products. This keeps the market competitive and allows consumers a broad choice of products that are guaranteed to be interoperable. If not for backward compatibility, every time a product improved, it would be incompatible with the existing infrastructure. Imagine buying a new spark plug for a three-year old car, only to find out you require a new car to use the plug! Computer systems, software, networks, and digital devices all function with a great deal of interdependence. As each component, device, program, network, or infrastructure is improved, backward co
Backward compatibility, as defined by Xilinx, refers only to the soldering process. Pb-free devices from Xilinx have the same form, fit and function as standard Pb-based products. No changes are required for board design when using Pb-free products from Xilinx. However, you may need to adjust board finish materials. Lead-frame packages (PQG, TQG, VQG, PCG, QFG, etc.) from Xilinx are backward compatible. The component can be soldered with Sn/Pb solder using a Sn/Pb soldering process. Lead-frame packages from Xilinx use a Matte Sn plating on the leads that is compatible with both Pb-free soldering alloys and Sn/Pb soldering alloy. However, we do not recommended soldering BGA packages (CPG, FTG, FGG, BGG, etc.) with SnPb solder using a Sn/Pb soldering process. The traditional Sn/Pb soldering process usually has a peak reflow temperature of 205 – 220 C. At this temperature range, the SnAgCu BGA solder balls do not properly melt and wet to the soldering surfaces. Reliability and assembly yi
