What effect do StencilQuik™ stencils have on the electrical characteristics of the assembly?
Testing has shown that when StencilQuik™ stencils are used with paste flux, there is a dramatic reduction in electrical leakage from pad to pad in BGA patterns. This is because the active ingredients of the flux are sequestered in the individual apertures of the StencilQuik™ stencil. BGA patterns that did not use StencilQuik™ stencils allow the flux residues to bridge across from one BGA pad to another.
