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What does Electronic Interconnect use as its standard for manufacturing?

April 26, 2017electronic Interconnect manufacturing standard

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What does Electronic Interconnect use as its standard for manufacturing?

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Unless it is specified in the zip file information you email to our pre-engineering staff, EIC follows a standard set of building parameters that are used. These include: ½-ounce copper on outer layers, 1-ounce copper on inner layers, FR4 material, 0.062″ finished thickness, LPI green solder mask over bare copper (SMOBC), and white silkscreen. Review our manufacturing capabilities to see the range offered on EIC.