What changes will be necessary in the customers process to use RoHS / Pb-free devices?
A. None, numerous studies indicate that RoHS / Pb-free components are compatible with board assembly processes using either SnPb (tin-lead) or SnAgCu (tin, silver, copper) solders. These RoHS / Pb-free devices are interchangeable in either board assembly method with no process changes required. However, due to the higher melting points of many RoHS / Pb-free solders, higher reflow temperatures may be required if the board assembly process is using a RoHS / Pb-free solder paste. Microsemi Integrated Products has tested all RoHS / Pb-free devices to ensure robustness at these elevated reflow temperatures while maintaining a Moisture Sensitivity Level of one (MSL 1) . Any devices not meeting a MSL of 1 will be clearly identified.
Related Questions
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- What changes will be necessary in the customers process to use RoHS / Pb-free devices?
- Are changes necessary in the customers process to use RoHS Compliant devices?
