What challenges are Telas solutions addressing?
Tela is focused enabling the co-optimization of physical design and IC manufacturing processes. Telas technology focuses on issues associated with the sub wavelength era of semiconductor manufacturing where features being patterned are smaller than the wavelength of the illumination light source. In this sub-wavelength era there is an opportunity to implement physical design structures that are more tuned to a particular lithography system and hence can be manufactured with better quality of results in terms of power, performance and area. With the acquisition of Blaze DFM, Tela can also optimize a design to minimize leakage power, a key design challenge as transistors scale to smaller geometries.
