What causes peak tailing on a TSKgel SW/SWxl SEC column?
The TSKgel SW/SWxl columns contain porous silica that has been chemically bonded with a proprietary hyprophilic material. This coating stabilizes the silica in aqueous solvents. When charged, strongly polar or hydrophobic molecules interact with the silica support, it is possible to have secondary electrostatic, hydrophilic or hydrophobic interaction between the solutes and the silica matrix. Thus, the separation involves two mechanisms, size exclusion and electrostatic, hydrophilic or hydrophobic interaction. When this occurs the chromatogram may exhibit peak tailing, as the number of adsorption sites that cause the secondary interaction is limited. The best way to avoid secondary interaction is to use a buffer with an ionic strength in excess of 200mM, e.g. 100mM phosphate buffer and 150mM NaCl, pH 6.8.
