What can I do if I need to remove more heat from the components inside the EMI/RFI cans/lids besides adding more ventilation holes and fans?
• Adding ventilation holes and fans outside of the EMI/RFI shielding can/cover can only achieve a basic level of heat removal of less than a watt. Higher power chips that are now used in communication may require much better thermal management along with EMI/RFI shielding. • AIT has a patented thermal solution of a compressible phase-change pad that can be pre-applied onto the EMI/RFI shielding can/cover before attachment to the circuit board. For best results, heat the lids to above 60°C before placement onto components or modules that need both thermal and EMI shielding requirements. This temperature permits good flow to minimize any trapped air gaps.
