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What assembly advice can you provide to reduce the chance of delamination in ROHS compliant boards?

April 26, 2017advice assembly chance compliant delamination reduce RoHS

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What assembly advice can you provide to reduce the chance of delamination in ROHS compliant boards?

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Epec Engineering has found that slower temperature ramp times and peak temperatures in the reflow profiles can help to reduce delamination issues. We recommend the ramp up temperature should be no more then 2.5 degrees C per second, and the peak temperature to be no more the 250 degrees C.