Important Notice: Our web hosting provider recently started charging us for additional visits, which was unexpected. In response, we're seeking donations. Depending on the situation, we may explore different monetization options for our Community and Expert Contributors. It's crucial to provide more returns for their expertise and offer more Expert Validated Answers or AI Validated Answers. Learn more about our hosting issue here.

What are the termination types on military ceramic chips?

April 26, 2017ceramic chips Military termination types

0

Posted

What are the termination types on military ceramic chips?

1 Answer

0

Posted

Military MLCC are available with either of two termination finishes. Our “Solderguard I” incorporates a Ni barrier layer to protect against leaching, with an over coating of Sn60 solder, applied by dipping. This termination meets the requirements of MIL-PRF-55681 “S” (solder coated, final), and “U” (base metallization – barrier metal – solder coated). For those customers requesting a plated termination, we offer “Solderguard II”, incorporating the same Ni barrier layer, which is then over-plated with pure matte Sn. This termination meets the current requirements of MIL-PRF-55681 “W” (base metallization – barrier metal – tinned or tin/lead alloy), or “Y” (base metallization – barrier metal – tinned – 100% Sn). In addition, we can supply gold plating over nickel, but this is considered a non-standard termination, and cannot be JAN branded.