What are the strengths and limitations to x-ray inspection in “bump” technology?
• Strengths: X-ray is excellent for viewing bridging, cold solder, voids, misregistration, plus insufficient and excessive reflow. • Limitations: X-ray is not considered to be effective when inspecting for opens, as typically opens do not appear much different than an insufficient reflow. It is recommended that the use of a BGA scope for optical side viewing be used to compliment the x-ray inspection for opens.