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What are the major benefits of C4NP compared to solder printing?

Benefits c4np printing solder
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What are the major benefits of C4NP compared to solder printing?

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1. C4NP has the flexibility to process ANY solder composition typically used for wafer bumping, including eutectic SnPb and lead free alloys. Evaporation is not considered feasible for lead free bumping due to the low vapor pressure of Sn.

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